Direct-to-Chip Liquid Cooling
Reliable,
Scalable Performance
Transform Thermal Management in Your High-Power Electronics
Our modules are easily integrable and can handle the market’s highest power density devices.
What can better cooling do for my application?
01
Safely Run Devices Harder
02
Increase Device Efficiency
03
Future-Proof Design
04
Minimize Cooling Costs
Loved by Engineers. Trusted by Enterprises.
As AI increases rack density, data centers are grappling with strict power limitations. Discover how JetCool’s liquid cooling solutions are helping data centers reduce power consumption while maximizing compute per rack, enhancing both efficiency and performance.
Whether deploying high density servers with eight GPUs or developing an AI factory, engineers choose JetCool’s direct-to-chip liquid cooling. Customers cool the highest power processors on the market while using very warm inlet coolant temperatures, over 50°C.
Design high-performance devices with enhanced power density and improved device efficiency ahead of your competition with JetCool’s liquid-to-die approaches: SmartLid (fluid-to-die) and SmartSilicon (embedded in silicon substrate).