Lenovo new low temperature solder manufacturing process set to reduce carbon emissions by 35%

Lenovo has announced a new patent-pending Low Temperature Solder (LTS) process developed to improve PC manufacturing by conserving energyand increasing reliability.

Ever since having to abandon the use of lead-based solder more than 10 years ago due to environmental concerns, the electronics industry has been searching for a solution to reduce heat, power consumption and carbon emissions by improving the tin-based solder process which replaced the older lead-based process.

The newer tin-based process required extremely high temperatures consuming more energy and adding significant stress on components.With a new LTS process, Lenovo proves it continues to be at the forefront of innovation, introducing a game-changing manufacturing process thatis not only applicable to Lenovo products, but can be universally applied to all electronics manufacturing involving printed circuit boards with no cost or performance impact to customers.

The true innovation is in the science and testing required to develop and validate the new LTS process. Lenovo investigated thousands of combinations of solder paste material composed of a mixture of tin, copper, bismuth nickel and silver, specific compositions of flux material and unique profiles of time and heat temperatures that combine to enable this process.

As is typical in standard electronics assembly using surface mount technology (SMT), the solder and flux mixture isfirst printedon the face of the circuit board.The componentsarethen addedand heat is applied to melt the solder mixture, securing and connecting the components to the board.

With the new LTS process, soldering heat is appliedat maximum temperatures of 180 degrees Celsius, a reduction of 70 degrees from the previous method.

Tags: Lenovo, Lenovo new low temperature solder manufacturing process set to reduce carbon emissions by 35%, Low Temperature Solder, Manila, manila bulletin, manila news, news today