Thermal design power

Thermal Design of Electronic Equipment by S.Rajaram

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• published: 18 Sep 2012
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ABSTRACT Performance and reliability of today's high-speed electronic systems depends critically upon good thermal design. Majority of field failures in electronics equipment are due to high temperature effects. Inadequate cooling always results in higher component temperature leading to failures. Increases in speed of Very Large Scale Integrated circuits ( VLSI ) have led to extremely high heat dissipation, making thermal considerations the limiting factor for performance. With miniaturization of micro-electronics and demand for small product form, heat fluxes on devices are constantly increasing and thermal design has become a critical factor in electronics equipment design. Thermal design aspects, if considered well in advance, can help in avoiding time and cost over-runs in critical product development and ensure better reliability. Thermal design of electronic equipment is a multifaceted subject invoking all areas of classical heat transfer. Actual electronic systems differ considerably from classical studies. Based on vast industrial experience, this seminar will give a broad overview of the practical and systematic thermal design process in a building block manner from whole systems to circuit boards, and packages that are practiced in industry today It also bridges the gap between academic studies and actual equipment design, to enable the engineer to design electronic systems for maximum reliability. Due to increasingly severe thermal constraints, such a systematic procedure is necessary at the earliest stage in design. The emphasis will be on practical applications, and actual equipment problems. Dr. S. Rajaram is a Senior Manager at Alcatel-Lucent, New Jersey, USA. He joined Bell Labs in 1981, and has worked extensively on thermal design, reliability engineering and testing of a wide range of electronics products in the data and telecom industry. He is one of the primary architects of the Environmental Stress testing (EST) at Lucent Technologies. He has trained engineers at Bell Labs and given short courses in the U.S, Europe, Taiwan, Singapore, India and China. He spent one year as a United Nations Expert to train electronics engineers in India. He received his Ph.D. in Engineering Science from the State University of New York at Buffalo. With a major in Mechanical Engineering, and a minor in Electromagnetics, he is knowledgeable in mechanical, thermal design, manufacturing, reliability/quality engineering and electrical aspects of electronics packaging and network engineering. He is currently a Product Manager in the Applications Software Group.