- published: 09 Nov 2014
- views: 2029
The Original Chip Set (OCS) was a chipset used in the earliest Commodore Amiga computers and defined the Amiga's graphics and sound capabilities. It was succeeded by the slightly improved Enhanced Chip Set (ECS) and greatly improved Advanced Graphics Architecture (AGA).
The original chipset appeared in Amiga models built between 1985 and 1990: the Amiga 1000, Amiga 2000, Amiga CDTV, and Amiga 500.
The chipset which gave the Amiga its unique graphics features consists of three main "custom" chips; Agnus, Denise, and Paula. Both the original chipset and the enhanced chipset were manufactured using NMOS logic technology by Commodore's chip manufacturing subsidiary, MOS Technology. According to Jay Miner, the OCS chipset was fabricated in 5 µm manufacturing process while AGA Lisa was implemented in 1.5 µm process. All three custom chips were originally packaged in 48-pin DIPs; later versions of Agnus, known as Fat Agnus, were packaged in an 84-pin PLCC.
Agnus is the central chip in the design. It controls all access to chip RAM from both the central 68000 processor and the other custom chips, using a complicated priority system. Agnus includes sub-components known as the blitter (fast transfer of data in memory without the intervention of the processor) and the Copper (video-synchronized co-processor). The original Agnus can address 512 KB of chip RAM. Later revisions, dubbed 'Fat Agnus', added 512 KB pseudo-fast RAM, which for ECS was changed to 1 MB (sometimes called 'Fatter Agnus') and subsequently to 2 MB chip RAM.
667 Denise is a minor planet orbiting the Sun.
A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
There are three commonly used plural forms: dice, dies, and die.
Single NPN bipolar junction transistor die.
Single NPN bipolar junction transistor die.
Close-up of an RGB light-emitting diode, showing the three individual silicon dice.
Close-up of an RGB light-emitting diode, showing the three individual silicon dice.
A small-scale integrated circuit die, with bond wires attached.
A small-scale integrated circuit die, with bond wires attached.
A VLSI integrated-circuit die.
A VLSI integrated-circuit die.
A die is a specialized tool used in manufacturing industries to cut or shape material mostly using a press. Like molds, dies are generally customized to the item they are used to create. Products made with dies range from simple paper clips to complex pieces used in advanced technology.
Forming dies are typically made by tool and die makers and put into production after mounting into a press. The die is a metal block that is used for forming materials like sheet metal and plastic. For the vacuum forming of plastic sheet only a single form is used, typically to form transparent plastic containers (called blister packs) for merchandise. Vacuum forming is considered a simple molding thermoforming process but uses the same principles as die forming. For the forming of sheet metal, such as automobile body parts, two parts may be used: one, called the punch, performs the stretching, bending, and/or blanking operation, while another part, called the die block, securely clamps the workpiece and provides similar stretching, bending, and/or blanking operation. The workpiece may pass through several stages using different tools or operations to obtain the final form. In the case of an automotive component there will usually be a shearing operation after the main forming is done and then additional crimping or rolling operations to ensure that all sharp edges are hidden and to add rigidity to the panel.
Die (French pronunciation: [di]; Occitan: Diá [ˈdjɔ]) is a commune, former episcopal see, and subprefecture of the Drôme department in southeastern France. The region around Die is known as the Diois.
Die is best known for the Clairette de Die, a sparkling wine. It was a county in the High Middle Ages. It was once the see of a Roman Catholic diocese and its cathedral remains.
Die is situated in a valley, surrounded by the Glandasse mountain (6696 feet), a massive and steep rocky barrier, which separates the area (Pays Diois) from the Vercors Plateau. The territory of the commune of Die is part of the regional natural park of these regions.
Clearly, there were inhabitants during the Neolithic age, this has been confirmed by Chanqueyras excavations. A big engraved standing stone and two small menhirs that are now in the Die museum were found near the wine cooperative, (these) also proved inhabitation in this area at that time. The remains of the final Bronze Age were discovered at La Roche De Marginal, for example, some shards have been found at Chandillon. A first agglomeration seems to have appeared at the beginning of the roman era, on a little mountain pass overhanging the Drôme, and the small valley of Meyrosse, at the crossroad between the valley and the path to Trièves. Lots of clues show the extension of urbanisation during the 1st century. At the beginning of the 2nd century, the city of Die constructs monuments and becomes a Roman capital, replacing Luc-en-Diois in that function for the Celtic people of northern Voconces. It seems it will be named as a colony towards the end of the 2nd century or during the 3rd century because the town became an important centre of fertility goddess Cybele’s cult.
Absolute is a music compilation album under both the Body and Soul and Midnight Soul collection series. Distributed by Time-Life through its music division, the album was released January 28, 2003 and was originally under the Body and Soul series. It was re-released in 2008 when Time-Life launched the Midnight Soul series.
It is distributed both in two versions: the single CD sold-in-stores and the Time-Life exclusive version on the double CD set. The sold-in-stores version features seventeen urban contemporary R&B hits, with many of them released in the Neo soul music era. The Time-Life exclusive version features 24 hits on 2 CDs, including seven more songs not featured in stores.
In linguistics, an absolute construction is a grammatical construction standing apart from a normal or usual syntactical relation with other words or sentence elements. It can be a non-finite clause that is subordinate in form and modifies an entire sentence, an adjective or possessive pronoun standing alone without a modified substantive, or a transitive verb when its object is implied but not stated. The term absolute derives from Latin absolūtum, meaning "loosened from" or "separated".
Because the non-finite clause, called the absolute clause (or simply the absolute), is not semantically attached to any single element in the sentence, it is easily confused with a dangling participle. The difference is that the participial phrase of a dangling participle is intended to modify a particular noun, but is instead erroneously attached to a different noun, whereas a participial phrase serving as an absolute clause is not intended to modify any noun at all.
While the absolute construction is not particularly common in modern English and is generally more often seen in writing than in speech, it may be spoken as one of several fixed expressions:
A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: dice, dies, and die. This video is targeted to blind users. Attribution: Article text available under CC-BY-SA Creative Commons image source in video
How are microchips made - from sand to semiconductor: Microelectronics usually is hidden to society – however, it is a constant companion in our daily lives. It tremendously contributes to the ongoing development and digitization of our world. But what is actually behind this technology? In this video we explain how microchips are made and what conditions are necessary for manufacturing. Read more about microchip manufacturing and the importance of wafers or semiconductor chips here: https://www.infineon.com/cms/en/product/promopages/how-a-chip-is-made-video/ ____________ Like this video? Subscribe to Infineon Technologies AG on YouTube: https://www.youtube.com/channel/UCoTflChMPX0VBFXvXYmcu9w?sub_confirmation=1 Infineon Technologies AG is a world leader in semiconductor solutions that...
I thought it would be interesting to try decapping some chips. This involves using fuming nitric acid, which also seemed fun, so I thought I would give it a go. The process starts by milling a precise pocket into the IC using my CNC machine. I used carbide tooling to cut the glass fiber/epoxy material. I then put a drop or two of the acid into the pocket, and raised the temperature to about 100*C. The acid dissolves the epoxy packaging as it sort of "dries". I added more acid to the pocket every few minutes. After about 10 minutes, I washed the IC in acetone, then reapplied acid if there was still material left on the die. Eventually, it was all cleared away, and I had a nice decapped IC.
Hi guys in this video we will discus about what is an ic , how it works , where to use them and can we even make one by ourself...? There are many types of ic but in this video we will discus about only two Hope you enjoy this video Regards Aatik!
Windell Oskay walks us through the process of understanding what an Integrated Circuit looks like, and how it operates. This booth at the 2019 Maker Faire Bay Area started by decapping a uL914 chip and looking at it under a microscope. From there, models were designed to explain the structure in a way that's really easy to follow. Read the article on Hackaday: https://hackaday.com/2019/05/20/integrated-circu…e-right-teachers/ Learn more about this exhibit: https://www.evilmadscientist.com/2019/uncovering-the-silicon-%CE%BCl914/
Get your first two months of CuriosityStream free by going to http://curiositystream.com/crashcourse and using the promo code “crashcourse”. So you may have heard of Moore's Law and while it isn't truly a law it has pretty closely estimated a trend we've seen in the advancement of computing technologies. Moore's Law states that we'll see approximately a 2x increase in transistors in the same space every two years, and while this may not be true for much longer, it has dictated the advancements we've seen since the introduction of transistors in the mid 1950s. So today we're going to talk about those improvements in hardware that made this possible - starting with the third generation of computing and integrated circuits (or ICs) and printed circuit boards (or PCBs). But as these technolog...
Interconnect Systems, ISI, can help you make the right connection between integrated circuit or bare die and printed circuit board. 3D & Advanced Packaging Miniaturization is necessary and possible because of wire bonding technology. Wirebonding takes place after die attach has been completed. • IC Packaging • Bare die on any substrate: FR4, thin board, flex, rigid flex, exotic materials • Die attach gold wire bonding; gold or aluminum wedge bonding • Encapsulation, glob-top or dam and fill • Flip chip including flux, high accuracy placement, reflow and underfill • Combination of bare and packaged die enabled reduced form factors • High performance organic substrate vs. ceramic provides a cost effective solution • Bare die assembly on flex/rigid circuits Our innovative 3D packaging tech...
episode 321 Intel 8080 microprocessor die under the microscope Be a Patron: https://www.patreon.com/imsaiguy
MBD Alchemie presents a 3D Physics video that is appropriate for Grade 12. This video with its outstanding graphics and high-end animation describes the different types and construction of integrated circuits (ICs). "Subscribe to our channel: https://www.youtube.com/channel/UCp1IKaxGFEy-TZ0mrW-oqXA Connect with us on Facebook: https://www.facebook.com/mbd.alchemie/ Please like, comment and subscribe to our channel." Tags: integrated circuit integrated circuit function integrated circuit diagram properties of integrated circuits Integrated Circuits lecture Integrated Circuits classification Integrated Circuits and applications #science #integratedcircuit
The Original Chip Set (OCS) was a chipset used in the earliest Commodore Amiga computers and defined the Amiga's graphics and sound capabilities. It was succeeded by the slightly improved Enhanced Chip Set (ECS) and greatly improved Advanced Graphics Architecture (AGA).
The original chipset appeared in Amiga models built between 1985 and 1990: the Amiga 1000, Amiga 2000, Amiga CDTV, and Amiga 500.
The chipset which gave the Amiga its unique graphics features consists of three main "custom" chips; Agnus, Denise, and Paula. Both the original chipset and the enhanced chipset were manufactured using NMOS logic technology by Commodore's chip manufacturing subsidiary, MOS Technology. According to Jay Miner, the OCS chipset was fabricated in 5 µm manufacturing process while AGA Lisa was implemented in 1.5 µm process. All three custom chips were originally packaged in 48-pin DIPs; later versions of Agnus, known as Fat Agnus, were packaged in an 84-pin PLCC.
Agnus is the central chip in the design. It controls all access to chip RAM from both the central 68000 processor and the other custom chips, using a complicated priority system. Agnus includes sub-components known as the blitter (fast transfer of data in memory without the intervention of the processor) and the Copper (video-synchronized co-processor). The original Agnus can address 512 KB of chip RAM. Later revisions, dubbed 'Fat Agnus', added 512 KB pseudo-fast RAM, which for ECS was changed to 1 MB (sometimes called 'Fatter Agnus') and subsequently to 2 MB chip RAM.
you know deep inside we are all out for pain
we`re condemning, forturing
and killing again and again waiting for deliverance
being nailed to the cross
hanging there like jesus christ
suspected animation antagonized to die
make your last confession within tonight
heads I win
tails you loose
blackest sin
trial by ordeal
forced smile, frozen face
annoyed arch enemy
no weakness, no frailty even
without empanthy
your mind is closed, disturbing fortitude
melt into a mental beast
forced to fight
steet annealed
prepare to strike
trial by ordeal
trial by ordeal decides your life or death
pouring out the vails
of wrath and damnation
taking a delight in an ungodly domain
blasphemous, unholy
benedicted under god`s name