3:20
1990 SEMATECH RAW YIELD Spoof
Music and Vocals by Carl Eckhardt and Lonnie Dickey Cameos by Robert Noyce -- co-inventor ...
published: 07 Mar 2011
author: Carl Eckhardt
1990 SEMATECH RAW YIELD Spoof
1990 SEMATECH RAW YIELD Spoof
Music and Vocals by Carl Eckhardt and Lonnie Dickey Cameos by Robert Noyce -- co-inventor of the Integrated Circuit Lonnie Hutchinson -- Bass Player for Mich...- published: 07 Mar 2011
- views: 334
- author: Carl Eckhardt
1:17
SEMATECH SIS-x CMP Evaluation
The SEMATECH CMP team is working to address several issues for Fab manufacturing engineers...
published: 10 May 2013
author: Sematech1
SEMATECH SIS-x CMP Evaluation
SEMATECH SIS-x CMP Evaluation
The SEMATECH CMP team is working to address several issues for Fab manufacturing engineers. One key cost reduction project is to quickly develop, validate, a...- published: 10 May 2013
- views: 99
- author: Sematech1
0:53
SEMATECH 3D Interconnect program - die bonding
The FC300 is high-precision die bonding tool capable of both die-to-die and die-to-wafer b...
published: 25 Aug 2010
author: Sematech1
SEMATECH 3D Interconnect program - die bonding
SEMATECH 3D Interconnect program - die bonding
The FC300 is high-precision die bonding tool capable of both die-to-die and die-to-wafer bonding and can populate wafers up to 300mm in diameter. Additional ...- published: 25 Aug 2010
- views: 1383
- author: Sematech1
0:48
SEMATECH 3D Interconnect program - all surface wafer inspection
Detects particles, chips and scratches as small as two microns on the top, bottom and edge...
published: 25 Aug 2010
author: Sematech1
SEMATECH 3D Interconnect program - all surface wafer inspection
SEMATECH 3D Interconnect program - all surface wafer inspection
Detects particles, chips and scratches as small as two microns on the top, bottom and edge bevel of wafers (all surfaces), both single wafers and bonded wafe...- published: 25 Aug 2010
- views: 971
- author: Sematech1
2:03
SEMATECH 3D Interconnect program - Wafer bonding tool
The Gemini is a fully automated 300mm wafer bonding tool. It also has modules for precisio...
published: 25 Aug 2010
author: Sematech1
SEMATECH 3D Interconnect program - Wafer bonding tool
SEMATECH 3D Interconnect program - Wafer bonding tool
The Gemini is a fully automated 300mm wafer bonding tool. It also has modules for precision wafer-to-wafer alignment, surface activation, and wafer cleaning....- published: 25 Aug 2010
- views: 4036
- author: Sematech1
9:57
Dr. Larry Browning's Sematech Lecture (IV)
Dr. Larry Browning at the University of Texas at Austin gave a lecture on Sematech at Free...
published: 08 Feb 2008
author: greenteaharbour
Dr. Larry Browning's Sematech Lecture (IV)
Dr. Larry Browning's Sematech Lecture (IV)
Dr. Larry Browning at the University of Texas at Austin gave a lecture on Sematech at Freescale in Austin on Nov 11, 2007.- published: 08 Feb 2008
- views: 91
- author: greenteaharbour
2:29
Semiconductor Nanodefectivity ... with Michael Lercel, SEMATECH
Nanodefectivity is a hot topic in semiconductors today as the industry pushes ahead toward...
published: 07 Jun 2013
author: wesrch
Semiconductor Nanodefectivity ... with Michael Lercel, SEMATECH
Semiconductor Nanodefectivity ... with Michael Lercel, SEMATECH
Nanodefectivity is a hot topic in semiconductors today as the industry pushes ahead towards 14nm. Sematech has been a critical resource in this effort and Mi...- published: 07 Jun 2013
- views: 14
- author: wesrch
4:57
Non-planar device scaling: SEMATECH talks TSV, SoC, SiP
For the first time, the semiconductor industry is moving to 3D device structures, such as ...
published: 19 May 2011
author: ElectroIQ
Non-planar device scaling: SEMATECH talks TSV, SoC, SiP
Non-planar device scaling: SEMATECH talks TSV, SoC, SiP
For the first time, the semiconductor industry is moving to 3D device structures, such as through silicon vias. This is significantly different than moving t...- published: 19 May 2011
- views: 469
- author: ElectroIQ
64:21
2013 SEMATECH IC Manufacturing Week's Key Note Address "Using PHM & CBM with Fab & Test Equipment"
The IC industry is plagued with high premature chip failures from a variety of reasons, co...
published: 06 Nov 2013
2013 SEMATECH IC Manufacturing Week's Key Note Address "Using PHM & CBM with Fab & Test Equipment"
2013 SEMATECH IC Manufacturing Week's Key Note Address "Using PHM & CBM with Fab & Test Equipment"
The IC industry is plagued with high premature chip failures from a variety of reasons, costing IC companies huge profit losses, predictive science and predictive algorithms used in a PHM and CBM program allows IC factories to produce more chips with higher reliability and longer life, allowing IC fab and test equipment to improve yield and output and lower factory O&M; costs by 50% while enabling a 24/7 manufacturing and test factory environment. This video was recorded at the 2013 SEMATECH Manufacturing Week held in Woodland Hills CA. In attendance was employees from IC manufacturing companies and IC fab and test equipment suppliers such as INTEL, IBM, Sony, Samsung and Fairchild. SEMATECH is a IC industry organization dedicated to advancing the IC industry fab and test technologies for member companies.- published: 06 Nov 2013
- views: 0
9:45
Dr. Larry Browning's Sematech Lecture (I)
Dr. Larry Browning at the University of Texas at Austin gave a lecture on Sematech at Free...
published: 08 Feb 2008
author: greenteaharbour
Dr. Larry Browning's Sematech Lecture (I)
Dr. Larry Browning's Sematech Lecture (I)
Dr. Larry Browning at the University of Texas at Austin gave a lecture on Sematech at Freescale in Austin on Nov 11, 2007.- published: 08 Feb 2008
- views: 370
- author: greenteaharbour
1:08
SEMATECH 3D Interconnect program - scanning acoustic microscope
Using a 110MHz transducer, ultrasonic soundwaves are transmitted or reflected through a bo...
published: 25 Aug 2010
author: Sematech1
SEMATECH 3D Interconnect program - scanning acoustic microscope
SEMATECH 3D Interconnect program - scanning acoustic microscope
Using a 110MHz transducer, ultrasonic soundwaves are transmitted or reflected through a bonded wafer pair. Voids at the interface of the bonded wafer pair as...- published: 25 Aug 2010
- views: 988
- author: Sematech1
1:05
SEMATECH 3D Interconnect program - IR metrology system
Using an infrared (IR) microscope, near infrared (NIR) wavelengths (1310nm) are used to "s...
published: 25 Aug 2010
author: Sematech1
SEMATECH 3D Interconnect program - IR metrology system
SEMATECH 3D Interconnect program - IR metrology system
Using an infrared (IR) microscope, near infrared (NIR) wavelengths (1310nm) are used to "see" through silicon wafers to inspect and measure features as small...- published: 25 Aug 2010
- views: 1184
- author: Sematech1
1:58
SEMATECH 3D Interconnect program - Plating tool
The Nexx Stratus300 is a fully automated electro-deposition system for advance packaging a...
published: 30 Aug 2010
author: Sematech1
SEMATECH 3D Interconnect program - Plating tool
SEMATECH 3D Interconnect program - Plating tool
The Nexx Stratus300 is a fully automated electro-deposition system for advance packaging applications. It has a unique architecture with multiple plating bat...- published: 30 Aug 2010
- views: 3019
- author: Sematech1
7:15
SEMATECH's Metrology Workshop, SEMICON West 2010
Created on July 21, 2010 using FlipShare....
published: 21 Jul 2010
author: 012565fvt
SEMATECH's Metrology Workshop, SEMICON West 2010
SEMATECH's Metrology Workshop, SEMICON West 2010
Created on July 21, 2010 using FlipShare.- published: 21 Jul 2010
- views: 737
- author: 012565fvt
Vimeo results:
2:28
Semiconductor Nanodefectivity ... with Michael Lercel, SEMATECH
Nanodefectivity is a hot topic in semiconductors today as the industry pushes ahead toward...
published: 07 Jun 2013
author: sophie vgats
Semiconductor Nanodefectivity ... with Michael Lercel, SEMATECH
Nanodefectivity is a hot topic in semiconductors today as the industry pushes ahead towards 14nm. Sematech has been a critical resource in this effort and Michael Lercel, Senior Director of their Nanodefectivity and Metrology Center talks about why and how the demands of nano-scale manufacturing below 50nm is changing the way we deal with particulates and surface contamination along with the effects of nanostructures in the new materials being used both at the wafer level and in the production equipment. He also addresses the economic challenges the supply chain faces in controlling rising R&D; costs.
Youtube results:
9:41
Dr. Larry Browning's Sematech Lecture (III)
Dr. Larry Browning at the University of Texas at Austin gave a lecture on Sematech at Free...
published: 08 Feb 2008
author: greenteaharbour
Dr. Larry Browning's Sematech Lecture (III)
Dr. Larry Browning's Sematech Lecture (III)
Dr. Larry Browning at the University of Texas at Austin gave a lecture on Sematech at Freescale in Austin on Nov 11, 2007.- published: 08 Feb 2008
- views: 172
- author: greenteaharbour
7:26
Dr. Larry Browning's Sematech Lecture (V)
Dr. Larry Browning at the University of Texas at Austin gave a lecture on Sematech at Free...
published: 08 Feb 2008
Dr. Larry Browning's Sematech Lecture (V)
Dr. Larry Browning's Sematech Lecture (V)
Dr. Larry Browning at the University of Texas at Austin gave a lecture on Sematech at Freescale in Austin on Nov 11, 2007.- published: 08 Feb 2008
- views: 59
0:47
Tendo Bulega for sematech
semakula seth have a son Tendo Bulega....
published: 17 Oct 2011
author: Evangelist Barnabas Serunjoji
Tendo Bulega for sematech
Tendo Bulega for sematech
semakula seth have a son Tendo Bulega.- published: 17 Oct 2011
- views: 17
- author: Evangelist Barnabas Serunjoji
1:23
Tendo Bulega for sematech Part 2
video uploaded from my mobile phone....
published: 17 Oct 2011
author: Evangelist Barnabas Serunjoji
Tendo Bulega for sematech Part 2
Tendo Bulega for sematech Part 2
video uploaded from my mobile phone.- published: 17 Oct 2011
- views: 8
- author: Evangelist Barnabas Serunjoji