Flip-chip pin grid array

Flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array integrated circuit packaging in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other cooling mechanism.

The FC-PGA package and its variants are used on certain Intel Celeron, Pentium III, and Pentium 4 family microprocessors. FC-PGA processors fit into zero insertion force (ZIF) Socket 370 and Socket 478 motherboard sockets; similar packages have also been used by AMD.

[edit] See also

• CPGA
• OPGA
• Pin grid array
• Wikihowto: Guide to IC packages
• Intel CPU Processor Identification
• Chip carrier Chip packaging and package types list